Parameters | |
---|---|
Element Configuration | Single |
Power Dissipation | 140mW |
Turn On Delay Time | 24 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 14m Ω @ 38A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 100μA |
Input Capacitance (Ciss) (Max) @ Vds | 3980pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 42A Tc |
Gate Charge (Qg) (Max) @ Vgs | 48nC @ 4.5V |
Rise Time | 110ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Fall Time (Typ) | 48 ns |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Turn-Off Delay Time | 33 ns |
Number of Pins | 3 |
Continuous Drain Current (ID) | 42A |
Operating Temperature | -55°C~175°C TJ |
Threshold Voltage | 2.5V |
Packaging | Tube |
Gate to Source Voltage (Vgs) | 16V |
Published | 2006 |
Drain to Source Breakdown Voltage | 100V |
Series | HEXFET® |
Dual Supply Voltage | 100V |
Part Status | Discontinued |
Recovery Time | 51 ns |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Nominal Vgs | 2.5 V |
Termination | SMD/SMT |
Height | 2.3876mm |
ECCN Code | EAR99 |
Length | 6.7056mm |
Resistance | 14MOhm |
Width | 6.22mm |
Technology | MOSFET (Metal Oxide) |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Number of Elements | 1 |
Power Dissipation-Max | 140W Tc |
Lead Free | Lead Free |