Parameters | |
---|---|
Power Dissipation-Max | 380W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 380W |
Case Connection | DRAIN |
Turn On Delay Time | 66 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 2.4m Ω @ 165A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 11210pF @ 50V |
Current - Continuous Drain (Id) @ 25°C | 195A Tc |
Gate Charge (Qg) (Max) @ Vgs | 140nC @ 4.5V |
Rise Time | 220ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Fall Time (Typ) | 110 ns |
Turn-Off Delay Time | 110 ns |
Continuous Drain Current (ID) | 270A |
Threshold Voltage | 2.5V |
Gate to Source Voltage (Vgs) | 16V |
Drain to Source Breakdown Voltage | 60V |
Mount | Surface Mount |
Dual Supply Voltage | 60V |
Mounting Type | Surface Mount |
Avalanche Energy Rating (Eas) | 290 mJ |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Nominal Vgs | 2.5 V |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Height | 4.83mm |
Published | 2008 |
Length | 10.67mm |
Series | HEXFET® |
Width | 9.65mm |
JESD-609 Code | e3 |
Radiation Hardening | No |
Part Status | Discontinued |
REACH SVHC | No SVHC |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
RoHS Status | ROHS3 Compliant |
Number of Terminations | 2 |
Lead Free | Lead Free |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Resistance | 2.4MOhm |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 1 |