Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Number of Pins | 3 |
Weight | 3.949996g |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2014 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN Code | EAR99 |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Number of Channels | 1 |
Power Dissipation-Max | 195W Tc |
Element Configuration | Single |
Power Dissipation | 195W |
Turn On Delay Time | 32 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 1.95m Ω @ 148A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 8020pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 160A Tc |
Gate Charge (Qg) (Max) @ Vgs | 83nC @ 4.5V |
Rise Time | 202ns |
Drain to Source Voltage (Vdss) | 30V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 102 ns |
Turn-Off Delay Time | 33 ns |
Continuous Drain Current (ID) | 160A |
Gate to Source Voltage (Vgs) | 20V |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |