Parameters | |
---|---|
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 88W |
Case Connection | DRAIN |
Turn On Delay Time | 11 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 8.5m Ω @ 15A, 4.5V |
Vgs(th) (Max) @ Id | 1.9V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 2490pF @ 6V |
Current - Continuous Drain (Id) @ 25°C | 84A Tc |
Mount | Through Hole |
Gate Charge (Qg) (Max) @ Vgs | 41nC @ 5V |
Mounting Type | Through Hole |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Rise Time | 14ns |
Number of Pins | 3 |
Drive Voltage (Max Rds On,Min Rds On) | 2.8V 4.5V |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Vgs (Max) | ±12V |
Packaging | Tube |
Fall Time (Typ) | 17 ns |
Published | 2004 |
Turn-Off Delay Time | 21 ns |
Series | HEXFET® |
Continuous Drain Current (ID) | 84A |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Gate to Source Voltage (Vgs) | 12V |
Number of Terminations | 3 |
Drain to Source Breakdown Voltage | 12V |
ECCN Code | EAR99 |
Height | 6.22mm |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Length | 6.7056mm |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 12V |
Width | 2.3876mm |
Technology | MOSFET (Metal Oxide) |
Radiation Hardening | No |
Peak Reflow Temperature (Cel) | 260 |
RoHS Status | RoHS Compliant |
Current Rating | 84A |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Lead Free | Lead Free |
Power Dissipation-Max | 88W Tc |
Element Configuration | Single |