Parameters | |
---|---|
Vgs(th) (Max) @ Id | 2.3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 4380pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 161A Tc |
Gate Charge (Qg) (Max) @ Vgs | 50nC @ 4.5V |
Rise Time | 42ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 19 ns |
Turn-Off Delay Time | 34 ns |
Continuous Drain Current (ID) | 161A |
Threshold Voltage | 2.3V |
Gate to Source Voltage (Vgs) | 20V |
Factory Lead Time | 1 Week |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 620A |
Mount | Through Hole |
Avalanche Energy Rating (Eas) | 1440 mJ |
Height | 6.22mm |
Length | 6.7056mm |
Mounting Type | Through Hole |
Width | 2.3876mm |
Package / Case | TO-251-3 Short Leads, IPak, TO-251AA |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Number of Pins | 3 |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tube |
Published | 2008 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Subcategory | FET General Purpose Power |
Voltage - Rated DC | 30V |
Technology | MOSFET (Metal Oxide) |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | 161A |
Time@Peak Reflow Temperature-Max (s) | 30 |
Number of Elements | 1 |
Power Dissipation-Max | 140W Tc |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 140W |
Case Connection | DRAIN |
Turn On Delay Time | 25 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.3m Ω @ 15A, 10V |