IRPS5401MTRPBF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 56-PowerVFQFN |
| Surface Mount | YES |
| Operating Temperature | -40°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| Number of Terminations | 56 |
| ECCN Code | EAR99 |
| Applications | Power Management - Communications, Storage, Embedded Computing & High Density Multi-Rail Systems |
| Voltage - Supply | 6V~14V |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 0.4mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Output Voltage | 4.85V |
| Supply Voltage-Max (Vsup) | 14V |
| Supply Voltage-Min (Vsup) | 1.2V |
| Number of Channels | 5 |
| Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT |
| Adjustable Threshold | YES |
| Current - Supply | 40mA |
| Max Junction Temperature (Tj) | 125°C |
| Ambient Temperature Range High | 85°C |
| Height | 1mm |
| Length | 7mm |
| Width | 7mm |
| RoHS Status | ROHS3 Compliant |
IRPS5401MTRPBF Description
The IRPS5401MTRPBF is a full-featured power management device that provides up to 5 output voltages to processors, FPGAs, and other multi-rail power systems. The typical rails required, including as core voltage, memory voltage, and I/O voltages, are provided by four high efficiency programmable switching regulators and a Source/Sink Linear regulator.
IRPS5401MTRPBF Features
5 integrated outputs are included in the full power system.
Switching Regulators 4A, 4A, 2A, and 2A
Source/Sink Linear Regulator 500mA
5.5V to 12V single rail operation
A-D outputs range from 0.25V to 5.1V, and LDO outputs range from 0.5V to 3.6V.
Allows you to combine outputs and/or use an external IR MOSFETTM Power supply.
Stage to boost output current to up to 50 amps
Current mode control without external compensation emulated
IRPS5401MTRPBF Applications
Multi-rail ASIC, FPGA, and CPU systems with high density
Systems for embedded computing
Systems for communication and storage
