Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
8-SOIC (0.154, 3.90mm Width) |
Operating Temperature |
-40°C~85°C |
Packaging |
Tape & Reel (TR) |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 (1 Year) |
Type |
Buffer, Accelerator |
Terminal Finish |
Matte Tin (Sn) - annealed |
Applications |
I2C - Hotswap |
Voltage - Supply |
2.3V~5.5V |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Base Part Number |
ISL33001 |
Output |
2-Wire Bus |
Pin Count |
8 |
Number of Channels |
2 |
Current - Supply |
4mA |
Input |
2-Wire Bus |
Capacitance - Input |
10pF |
RoHS Status |
ROHS3 Compliant |
ISL33001IBZ-T Overview
This power buffer comes packaged in 8-SOIC (0.154, 3.90mm Width) so that it can be transported easily.Currently, this power buffer is ready to ship in Tape & Reel (TR) packages.Surface Mount Universal mout to make it easier for you to adjust.Speaking of types, this is a typical Buffer, Accelerator.The op amp buffer uses a voltage of 2.3V~5.5V volts for its operation.It is important for 2 channels to work together to ensure quality output.It facilitates 2-Wire Bus input.A -40°C~85°C operating temperature is recommended to avoid malfunctions.Operational amplifier buffers like this are designed to target applications like I2C - Hotswap and others.There are more pin-to-pin solutions available for your special needs if you search with the letter "ISL33001".During reflow, it reaches a peak temperature of NOT SPECIFIED.It starts with the 8 pins of the Power buffer in order to determine the pinout of the Power buffer.A 2-Wire Bus value is output by the program.In other words, it is a 4mA op amp buffer.
ISL33001IBZ-T Features
2 channels.
Mainly used in I2C - Hotswap.
ISL33001IBZ-T Applications
There are a lot of Renesas Electronics America Inc. ISL33001IBZ-T Signal Buffers, Repeaters, Splitters applications.
- Portable IPC/HMI
- Protection Switching
- Network Switches/Routers
- Desktop Computers
- Digital Cross-Connects
- DSLAMs
- Multidrop Buses
- Digital Crossconnects
- Data or Clock Signal Amplification
- PECL-to-LVDS Translation