Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Package / Case |
DFN |
Number of Pins |
10 |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 |
Number of Terminations |
10 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) - annealed |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
HTS Code |
8542.39.00.01 |
Subcategory |
Power Management Circuits |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
5V |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
5.5V |
Power Supplies |
5V |
Temperature Grade |
INDUSTRIAL |
Supply Voltage-Min (Vsup) |
2.3V |
Number of Channels |
2 |
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT |
Adjustable Threshold |
NO |
Height Seated (Max) |
1mm |
Length |
3mm |
Width |
3mm |
RoHS Status |
RoHS Compliant |
ISL61853GIRZ Overview
In the DFN package you will find it.At the moment, there are 2 channels available.The 10 terminations total to three.A device's terminal position is DUAL.High efficiency can be achieved with a voltage supply of 5V.10 pins are used to operate the system.Power Management Circuits contains this gadget on its own.There is a Surface Mount-axis orientation to it.In order to ensure stable operation, a maximum operating temperature of 85°C°C must be set.To maintain reliability, it functions at a minimum working temperature of -40°C degrees Celsius.For normal operation, the supply voltage (Vsup) should be kept above 2.3V in order to maintain a constant level of power.5.5V is set for Vsup (maximum supply voltage).The power supply of the part is referred to as 5V.An analog IC, in this case POWER SUPPLY SUPPORT CIRCUIT, is used in this gadget.
ISL61853GIRZ Features
ISL61853GIRZ Applications
There are a lot of Intersil (Renesas Electronics America) ISL61853GIRZ hot swap controllers applications.
- Power monitoring
- Identify faulty boards
- Hard drive
- Data communication systems
- Thermal limitation
- Networking
- Limitting the inrush current
- High power circuit board
- Continuous monitoring of device temperature
- Load transient protection