Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Package / Case |
DFN |
Number of Pins |
8 |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) - annealed |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Subcategory |
Power Management Circuits |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Number of Functions |
1 |
Supply Voltage |
5V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
5.5V |
Power Supplies |
5V |
Temperature Grade |
COMMERCIAL |
Supply Voltage-Min (Vsup) |
2.5V |
Number of Channels |
1 |
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT |
Adjustable Threshold |
NO |
Height Seated (Max) |
1mm |
Length |
3mm |
Width |
3mm |
RoHS Status |
RoHS Compliant |
ISL61862ECRZ Overview
There is a DFN package that includes this.At the moment, there are 1 channels available.In total, it has 8 terminations.In this case, the device is located at terminal DUAL.A supply voltage of 5V can result in high efficiency.In order to operate, 8 pins are used.Despite its self-contained nature, Power Management Circuits is a very compact device.The position of the object is in the direction of Surface Mount.Stable operation can be achieved with a maximum operating temperature of 70°C°C.At a minimum working temperature of 0°C degrees Celsius, it maintains reliability.For normal operation, Vsup should be kept above 2.5V.In the Vsup (maximum supply voltage) setting, 5.5V is selected.Hot-swappable device is 5V type power supplies that are used in this part.This gadget uses an analog IC, which is POWER SUPPLY SUPPORT CIRCUIT in this case.
ISL61862ECRZ Features
ISL61862ECRZ Applications
There are a lot of Intersil (Renesas Electronics America) ISL61862ECRZ hot swap controllers applications.
- Industrial application
- Hard drive
- Network switches
- High power circuit board
- Disconnect faulty loads before supply voltage drops
- Base station
- Thermal limitation
- Redundant Array of Disks (RAID)
- Other forms of communications infrastructure
- Backplane