Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-264-3, TO-264AA |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tube |
Published | 2008 |
Series | GenX3™ |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Subcategory | Insulated Gate BIP Transistors |
Max Power Dissipation | 1.25kW |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | IXG*200N60 |
Pin Count | 3 |
JESD-30 Code | R-PSIP-T3 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Power Dissipation | 1.25kW |
Case Connection | COLLECTOR |
Input Type | Standard |
Power - Max | 1250W |
Transistor Application | POWER CONTROL |
Polarity/Channel Type | N-CHANNEL |
Collector Emitter Voltage (VCEO) | 1.5V |
Max Collector Current | 75A |
Collector Emitter Breakdown Voltage | 600V |
Collector Emitter Saturation Voltage | 1.35V |
Turn On Time | 122 ns |
Test Condition | 300V, 100A, 1 Ω, 15V |
Vce(on) (Max) @ Vge, Ic | 1.5V @ 15V, 100A |
Turn Off Time-Nom (toff) | 730 ns |
IGBT Type | PT |
Gate Charge | 750nC |
Current - Collector Pulsed (Icm) | 600A |
Td (on/off) @ 25°C | 44ns/310ns |
Switching Energy | 1.6mJ (on), 2.9mJ (off) |
Gate-Emitter Voltage-Max | 20V |
Gate-Emitter Thr Voltage-Max | 5V |
Fall Time-Max (tf) | 300ns |
RoHS Status | ROHS3 Compliant |