Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 4 weeks ago) |
Contact Plating | Lead, Tin |
Mount | Through Hole |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1999 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.50 |
Max Power Dissipation | 480mW |
Technology | ZENER |
Terminal Position | AXIAL |
Terminal Form | WIRE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | not_compliant |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 2 |
Reference Standard | MIL-19500/117 |
Qualification Status | Qualified |
Number of Elements | 1 |
Polarity | UNIDIRECTIONAL |
Element Configuration | Single |
Diode Type | ZENER DIODE |
Power Dissipation | 500mW |
Case Connection | ISOLATED |
Test Current | 10.5mA |
Reference Voltage | 12V |
Zener Voltage | 12V |
Voltage Tol-Max | 5% |
JEDEC-95 Code | DO-35 |
Voltage Tolerance | 5% |
RoHS Status | Non-RoHS Compliant |