Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | A, Axial |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1996 |
Series | Military, MIL-PRF-19500/359 |
JESD-609 Code | e0 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.80 |
Terminal Form | WIRE |
Pin Count | 2 |
Reference Standard | MIL-19500/359F |
Qualification Status | Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 1μA @ 200V |
Voltage - Forward (Vf) (Max) @ If | 1.3V @ 1A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -65°C~175°C |
Output Current-Max | 1A |
Forward Voltage | 1.3V |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 1A |
Reverse Recovery Time | 150 ns |
Peak Reverse Current | 1μA |
Max Repetitive Reverse Voltage (Vrrm) | 200V |
Peak Non-Repetitive Surge Current | 15A |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |