Parameters | |
---|---|
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | E-MELF |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -55°C~175°C TJ |
Packaging | Bulk |
Published | 1997 |
Series | Military, MIL-PRF-19500/516 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Type | Zener |
Terminal Finish | Tin/Lead (Sn/Pb) |
Applications | General Purpose |
Max Power Dissipation | 500W |
Technology | AVALANCHE |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Pin Count | 2 |
Qualification Status | Qualified |
Number of Elements | 1 |
Leakage Current | 1μA |
Element Configuration | Single |
Case Connection | ISOLATED |
Power Line Protection | No |
Current - Peak Pulse (10/1000μs) | 16.4A |
Voltage - Clamping (Max) @ Ipp | 30.5V |
Clamping Voltage | 30.5V |
Peak Pulse Current | 16.4A |
Reverse Standoff Voltage | 16.7V |
Peak Pulse Power | 500W |
Direction | Bidirectional |
Test Current | 50mA |
Breakdown Voltage | 20.9V |
Bidirectional Channels | 1 |
Reverse Breakdown Voltage | 20.9V |
RoHS Status | Non-RoHS Compliant |