Parameters | |
---|---|
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1999 |
Series | Military, MIL-PRF-19500/609 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.70 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Pin Count | 2 |
Reference Standard | MIL-19500/609D |
Qualification Status | Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 100nA @ 75V |
Voltage - Forward (Vf) (Max) @ If | 1.2V @ 300mA |
Case Connection | ISOLATED |
Forward Current | 300mA |
Operating Temperature - Junction | -65°C~175°C |
Output Current-Max | 0.3A |
Current - Average Rectified (Io) | 300mA DC |
Forward Voltage | 1.2V |
Reverse Recovery Time | 4ns |
Max Repetitive Reverse Voltage (Vrrm) | 75V |
Peak Non-Repetitive Surge Current | 2.5A |
Reverse Current-Max | 0.1μA |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | SQ-MELF, D |
Number of Pins | 2 |