KMC68302EH16C
| Parameters | |
|---|---|
| Package / Case | 132-BQFP Bumpered |
| Operating Temperature | 0°C~70°C TA |
| Packaging | Tray |
| Published | 1996 |
| Series | M683xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MC68302 |
| Speed | 16MHz |
| Core Processor | M68000 |
| Voltage - I/O | 5.0V |
| Number of Cores/Bus Width | 1 Core 8/16-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | GCI, IDL, ISDN, NMSI, PCM, SCPI |
| Co-Processors/DSP | Communications; RISC CPM |
| RoHS Status | ROHS3 Compliant |
KMC68302EH16C Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 132-BQFP Bumpered. High reliability can be achieved by using the advanced packaging method Tray. A CPU with 1 Core 8/16-Bit cores and width 1 Core 8/16-Bit busses is used. The operating temperature around 0°C~70°C TA should be understood. The cpu microprocessor belongs to the M683xx series. A M68000 processor powers this CPU. A total of DRAM RAM controllers are used by this CPU. Microprocessors with GCI, IDL, ISDN, NMSI, PCM, SCPI interfaces are designed to serve users better. In this CPU, I/O is set to 5.0V. You can search for variants of a microprocessor with MC68302.
KMC68302EH16C Features
M68000 Core
KMC68302EH16C Applications
There are a lot of NXP USA Inc. KMC68302EH16C Microprocessor applications.
- Consumer electronics products
- DDC control
- Magnetic resonance imaging (MRI)
- Calculator
- Sonography (Ultrasound imaging)
- Microwave ovens
- Smart instruments
- Metering & measurement field
- Set-top boxes
- Industrial control field
