Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
1995 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68EN360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMC68EN360ZQ25VL Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. A high level of reliability is provided by using an advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Extended operating temperature around 0°C~70°C TA. This is a member of the M683xx series. The CPU is powered by a CPU32+ core. It has DRAM RAM controllers. To serve better this microprocessor features SCC, SMC, SPI interfaces. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with MC68EN360.
KMC68EN360ZQ25VL Features
CPU32+ Core
KMC68EN360ZQ25VL Applications
There are a lot of NXP USA Inc. KMC68EN360ZQ25VL Microprocessor applications.
- Oscilloscopes
- Ipad
- Heater/Fan
- Printers
- DVD\DV\MP3 players
- Current meter
- Industrial control field
- Information appliances (networking of household appliances)
- Measurement and control field
- Network communication, mobile communication field