Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
1998 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68MH360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMC68MH360ZQ25VL Overview
Due to its 357-BBGA packaging, it is convenient to ship overseas. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Extended operating temperature around 0°C~70°C TA. This is part of the M683xx series. This CPU is cored with a CPU32+ processor. There are DRAM RAM controllers used by this CPU. With its SCC, SMC, SPI interfaces, this microprocessor will be able to serve you better. There is 3.3V I/O running on this CPU. Use MC68MH360 when searching for variants of the embedded microprocessor.
KMC68MH360ZQ25VL Features
CPU32+ Core
KMC68MH360ZQ25VL Applications
There are a lot of NXP USA Inc. KMC68MH360ZQ25VL Microprocessor applications.
- Hard drives
- Microwave ovens
- Smart highways (navigation, traffic control, information monitoring and car service)
- Paper shredders
- Electromechanical control
- Petrochemical
- Instrumentation and process control field
- Auto-breaking system
- DCS control intelligent sensor
- Mobile computers