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KMC68MH360ZQ25VL

CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-KMC68MH360ZQ25VL
  • Package: 357-BBGA
  • Datasheet: PDF
  • Stock: 497
  • Description: CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA (Kg)

Details

Tags

Parameters
Package / Case 357-BBGA
Operating Temperature 0°C~70°C TA
Packaging Tray
Published 1998
Series M683xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68MH360
Speed 25MHz
Core Processor CPU32+
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

KMC68MH360ZQ25VL Overview


Due to its 357-BBGA packaging, it is convenient to ship overseas. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Extended operating temperature around 0°C~70°C TA. This is part of the M683xx series. This CPU is cored with a CPU32+ processor. There are DRAM RAM controllers used by this CPU. With its SCC, SMC, SPI interfaces, this microprocessor will be able to serve you better. There is 3.3V I/O running on this CPU. Use MC68MH360 when searching for variants of the embedded microprocessor.

KMC68MH360ZQ25VL Features


CPU32+ Core

KMC68MH360ZQ25VL Applications


There are a lot of NXP USA Inc. KMC68MH360ZQ25VL Microprocessor applications.

  • Hard drives
  • Microwave ovens
  • Smart highways (navigation, traffic control, information monitoring and car service)
  • Paper shredders
  • Electromechanical control
  • Petrochemical
  • Instrumentation and process control field
  • Auto-breaking system
  • DCS control intelligent sensor
  • Mobile computers

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