Parameters |
Package / Case |
668-BBGA Exposed Pad |
Supplier Device Package |
668-PBGA-PGE (29x29) |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Series |
MPC83xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Base Part Number |
MC8358 |
Speed |
400MHz |
Core Processor |
PowerPC e300 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, DDR2 |
USB |
USB 1.x (1) |
Additional Interfaces |
DUART, HDLC, I2C, PCI, SPI, UART |
Co-Processors/DSP |
Communications; QUICC Engine, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
ROHS3 Compliant |
KMC8358ECZQAGDDA Overview
With a packing size of 668-BBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. A high level of reliability is provided by using an advanced packaging method Tray. There are 1 Core 32-Bit cores per bus width on the CPU. Be aware of the operating temperature around -40°C~105°C TA. The cpu microprocessor belongs to the MPC83xx series. Core-wise, this CPU has a PowerPC e300 processor. A CPU with this architecture uses DDR, DDR2 RAM controllers. This microprocessor has DUART, HDLC, I2C, PCI, SPI, UART interfaces to serve you better. The CPU runs at 1.8V 2.5V 3.3V when it comes to I/O. Use MC8358 when searching for variants of the embedded microprocessor. Suppliers offer a package of 668-PBGA-PGE (29x29).
KMC8358ECZQAGDDA Features
PowerPC e300 Core
KMC8358ECZQAGDDA Applications
There are a lot of NXP USA Inc. KMC8358ECZQAGDDA Microprocessor applications.
- Heater/Fan
- Consumer electronics products
- Television
- Network communication, mobile communication field
- Fabric
- Accu-check
- Fax machines
- Projectors
- Printers
- Computer/laptop