KMC850DSLCZQ50BU
| Parameters | |
|---|---|
| Package / Case | 256-BBGA |
| Operating Temperature | -40°C~95°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MC850 |
| Speed | 50MHz |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | SDRAM |
| USB | USB 1.x (1) |
| Additional Interfaces | HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART |
| RoHS Status | Non-RoHS Compliant |
KMC850DSLCZQ50BU Overview
The embedded microprocessor has been packed in 256-BBGA for convenient overseas shipping. Advanced packaging method Tray is used to provide high reliability. Cores/Bus width of the CPU is 1 Core 32-Bit . Recognize operating temperatures around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. A total of SDRAM RAM controllers are used by this CPU. This microprocessor has HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART interfaces to serve you better. 3.3V is the CPU's I/O address. To find variants of the microprocessor, try searching with MC850.
KMC850DSLCZQ50BU Features
KMC850DSLCZQ50BU Applications
There are a lot of NXP USA Inc. KMC850DSLCZQ50BU Microprocessor applications.
- Food and beverage
- Security systems
- Missile control
- Temperature sensing and controlling devices
- Smoke alarms
- Xbox
- Hard drives
- Binding machines
- X-ray
- Leakage current tester
