Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8241 |
Speed |
166MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
Non-RoHS Compliant |
KMPC8241LZQ166D Overview
Since the microprocessor is packed in 357-BBGA, shipping overseas is convenient. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~105°C TA should be understood. This is part of the MPC82xx series. This CPU is cored with a PowerPC 603e processor. The CPU contains SDRAM RAM controllers. A I2C, I2O, PCI, UART interface has been added to this microprocessor in order to serve the user better. At 3.3V, the CPU runs its I/O. Use MPC8241 to search for variants of the cpu microprocessor. Suppliers offer a 357-PBGA (25x25) package.
KMPC8241LZQ166D Features
PowerPC 603e Core
KMPC8241LZQ166D Applications
There are a lot of NXP USA Inc. KMPC8241LZQ166D Microprocessor applications.
- Digital TVs
- Agriculture, transportation field
- Refrigerators
- Wastewater treatment
- Safety field
- Computed Tomography (CT scan)
- Network application field
- Mice
- DCS control intelligent sensor
- Traditional industrial transformation