Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8241 |
Speed |
166MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
Non-RoHS Compliant |
KMPC8241TZQ166D Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. It is important to understand the operating temperature around -40°C~105°C TA. It comes from the MPC82xx series. A PowerPC 603e processor is present in this CPU. A total of SDRAM RAM controllers are used by this CPU. Featuring I2C, I2O, PCI, UART interfaces, this microprocessor can better serve you. In this CPU, I/O is set to 3.3V. To find variants of the microprocessor, try searching with MPC8241. There is a 357-PBGA (25x25) package offered by suppliers.
KMPC8241TZQ166D Features
PowerPC 603e Core
KMPC8241TZQ166D Applications
There are a lot of NXP USA Inc. KMPC8241TZQ166D Microprocessor applications.
- Ipad
- Mice
- Industrial robot
- DDC control
- Speed meter
- Current meter
- Paper shredders
- Tape drives
- Communication-bluetooth, Wi-Fi, radio
- X-ray