Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8241 |
Speed |
200MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
Non-RoHS Compliant |
KMPC8241TZQ200D Overview
Since the microprocessor is packed in 357-BBGA, shipping overseas is convenient. High reliability is achieved using advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Identify the operating temperature around -40°C~105°C TA. In the MPC82xx series, it is found. The CPU is powered by a PowerPC 603e core. There are SDRAM RAM controllers used by this CPU. This microprocessor features interfaces I2C, I2O, PCI, UART. The CPU runs I/O at 3.3V. MPC8241 is a good way to search for variants of the microprocessor. 357-PBGA (25x25) package is offered by suppliers.
KMPC8241TZQ200D Features
PowerPC 603e Core
KMPC8241TZQ200D Applications
There are a lot of NXP USA Inc. KMPC8241TZQ200D Microprocessor applications.
- Petrochemical
- Toys
- Fire alarms
- Blenders
- Robots
- Toasters
- Digital set-top boxes
- Industrial control field
- Fabric
- Heater/Fan