Parameters |
Package / Case |
352-LBGA |
Supplier Device Package |
352-TBGA (35x35) |
Operating Temperature |
0°C~85°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8245 |
Speed |
400MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
ROHS3 Compliant |
KMPC8245ARVV400D Overview
With a packing size of 352-LBGA, this embedded microprocessor is ideal for international shipping. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores/bus width on the CPU. Understand how the operating temperature around 0°C~85°C TA is determined. This is part of the MPC82xx series. With a core count of PowerPC 603e, this CPU is multicore. There are SDRAM RAM controllers on this CPU. With its I2C, I2O, PCI, UART interfaces, this microprocessor will be able to serve you better. There is 3.3V I/O running on this CPU. Use MPC8245 to search for variants of the cpu microprocessor. A supplier offers a 352-TBGA (35x35) package.
KMPC8245ARVV400D Features
PowerPC 603e Core
KMPC8245ARVV400D Applications
There are a lot of NXP USA Inc. KMPC8245ARVV400D Microprocessor applications.
- Answering machines
- Medical instruments chromatographs
- Communication-bluetooth, Wi-Fi, radio
- Keyboards
- Food and beverage
- Oil and gas
- Speed meter
- Teletext terminals
- Robots
- Ipad