Parameters |
Package / Case |
352-LBGA |
Supplier Device Package |
352-TBGA (35x35) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8245 |
Speed |
300MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
ROHS3 Compliant |
KMPC8245LVV300D Overview
With a packing size of 352-LBGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores/bus width on the CPU. Extended operating temperature around 0°C~105°C TA. The MPC82xx series contains it. The CPU is cored with a PowerPC 603e processor. This CPU uses SDRAM RAM controllers. With its I2C, I2O, PCI, UART interfaces, this microprocessor will be able to serve you better. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC8245 if you are looking for variants. A supplier offers a 352-TBGA (35x35) package.
KMPC8245LVV300D Features
PowerPC 603e Core
KMPC8245LVV300D Applications
There are a lot of NXP USA Inc. KMPC8245LVV300D Microprocessor applications.
- Washing machines
- Oil and gas
- Network communication, mobile communication field
- Home video and audio
- Answering machines
- Walkie talkies
- Computed Tomography (CT scan)
- Ipad
- Ipod
- Traditional industrial transformation