Parameters |
Package / Case |
352-LBGA |
Supplier Device Package |
352-TBGA (35x35) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8245 |
Speed |
333MHz |
Core Processor |
PowerPC 603e |
Voltage - I/O |
3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
SDRAM |
Additional Interfaces |
I2C, I2O, PCI, UART |
RoHS Status |
ROHS3 Compliant |
KMPC8245LVV333D Overview
Due to its 352-LBGA packaging, it is convenient to ship overseas. High reliability is achieved by using advanced packaging methods Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Obtain a basic understanding of operating temperature around 0°C. In the series MPC82xx, it is found. With a core count of PowerPC 603e, this CPU is multicore. The CPU contains SDRAM RAM controllers. This microprocessor features I2C, I2O, PCI, UART interfaces to better serve its users. At 3.3V, the CPU runs its I/O. Search MPC8245 for variants of the embedded microprocessor. 352-TBGA (35x35) package is offered by suppliers.
KMPC8245LVV333D Features
PowerPC 603e Core
KMPC8245LVV333D Applications
There are a lot of NXP USA Inc. KMPC8245LVV333D Microprocessor applications.
- Mice
- Accu-check
- Network communication, mobile communication field
- Entertainment products
- Television
- Industrial instrumentation devices
- Ipad
- Petrochemical
- Firewalls
- Nintendo