KMPC8247ZQTMFA
| Parameters | |
|---|---|
| Package / Case | 516-BBGA |
| Operating Temperature | 0°C~105°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC82xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC8247 |
| Speed | 400MHz |
| Core Processor | PowerPC G2_LE |
| Voltage - I/O | 3.3V |
| Ethernet | 10/100Mbps (2) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM, SDRAM |
| USB | USB 2.0 (1) |
| Additional Interfaces | I2C, SCC, SMC, SPI, UART, USART |
| Co-Processors/DSP | Communications; RISC CPM |
| RoHS Status | Non-RoHS Compliant |
KMPC8247ZQTMFA Overview
Since the microprocessor is packed in 516-BBGA, shipping overseas is convenient. In order to provide high reliability, advanced packaging method Tray is used. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around 0°C~105°C TA. The MPC82xx series contains it. The CPU is powered by a PowerPC G2_LE core. The CPU uses DRAM, SDRAM RAM controllers. This microprocessor features I2C, SCC, SMC, SPI, UART, USART interfaces to better serve its users. 3.3V is the I/O speed of this CPU. MPC8247 is a good way to search for variants of the microprocessor.
KMPC8247ZQTMFA Features
PowerPC G2_LE Core
KMPC8247ZQTMFA Applications
There are a lot of NXP USA Inc. KMPC8247ZQTMFA Microprocessor applications.
- Safety field
- Network communication, mobile communication field
- Electronic jamming systems
- Dishwashers
- Binding machines
- Embedded gateways
- Graphic terminals
- Industrial robot
- Computed Tomography (CT scan)
- Guidance-GPS
