Parameters |
Package / Case |
480-LBGA Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC8260 |
Speed |
200MHz |
Core Processor |
PowerPC G2 |
Voltage - I/O |
3.3V |
Ethernet |
10/100Mbps (3) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM, SDRAM |
Additional Interfaces |
I2C, SCC, SMC, SPI, UART, USART |
Co-Processors/DSP |
Communications; RISC CPM |
RoHS Status |
ROHS3 Compliant |
KMPC8260ACVVMIBB Overview
With a packing size of 480-LBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Extended operating temperature around -40°C~105°C TA. In the series MPC82xx, it is found. Core-wise, this CPU has a PowerPC G2 processor. A CPU with this architecture uses DRAM, SDRAM RAM controllers. Microprocessors with I2C, SCC, SMC, SPI, UART, USART interfaces are designed to serve users better. There is 3.3V I/O running on this CPU. Use PC8260 to search for variants of the cpu microprocessor.
KMPC8260ACVVMIBB Features
PowerPC G2 Core
KMPC8260ACVVMIBB Applications
There are a lot of NXP USA Inc. KMPC8260ACVVMIBB Microprocessor applications.
- Mice
- Graphic terminals
- Copiers
- Digital TVs
- Firewalls
- Playstation
- Smartphone
- Virtual reality VR robots
- Broadband technology, video and voice processing
- Scanners