Parameters |
Package / Case |
516-BBGA |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8270 |
Speed |
266MHz |
Core Processor |
PowerPC G2_LE |
Voltage - I/O |
3.3V |
Ethernet |
10/100Mbps (3) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
I2C, SCC, SMC, SPI, UART, USART |
Co-Processors/DSP |
Communications; RISC CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC8270CZQMIBA Overview
The microprocessor is convenient for international shipping since it is packaged in 516-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around -40°C~105°C TA. In the series MPC82xx, it is found. A PowerPC G2_LE processor powers this CPU. The CPU contains DRAM, SDRAM RAM controllers. This microprocessor is equipped with an interface of I2C, SCC, SMC, SPI, UART, USART. At 3.3V, the CPU runs its I/O. To find variants of the microprocessor, try searching with MPC8270.
KMPC8270CZQMIBA Features
PowerPC G2_LE Core
KMPC8270CZQMIBA Applications
There are a lot of NXP USA Inc. KMPC8270CZQMIBA Microprocessor applications.
- Smartphones-calling, video calling, texting, email
- Gas monitoring systems
- Laminators
- Fire alarms
- Calculator
- Firewalls
- Torpedo guidance
- Wastewater treatment
- Network communication, mobile communication field
- Toasters