Parameters |
Package / Case |
516-BBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC82xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8271 |
Speed |
400MHz |
Core Processor |
PowerPC G2_LE |
Voltage - I/O |
3.3V |
Ethernet |
10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
I2C, SCC, SMC, SPI, UART, USART |
Co-Processors/DSP |
Communications; RISC CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC8271ZQTMFA Overview
Due to its 516-BBGA packaging, it is convenient to ship overseas. Advanced packaging method Tray is used to provide high reliability. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Be aware of the operating temperature around 0°C~105°C TA. The MPC82xx series contains it. A PowerPC G2_LE processor powers this CPU. The CPU contains DRAM, SDRAM RAM controllers. With its I2C, SCC, SMC, SPI, UART, USART interfaces, this microprocessor will be able to serve you better. This CPU runs I/O at 3.3V. Try searching for variants of the cpu microprocessor with MPC8271.
KMPC8271ZQTMFA Features
PowerPC G2_LE Core
KMPC8271ZQTMFA Applications
There are a lot of NXP USA Inc. KMPC8271ZQTMFA Microprocessor applications.
- Agriculture, transportation field
- Computed Tomography (CT scan)
- Answering machines
- Industrial instrumentation devices
- Instrument control
- Smartphones-calling, video calling, texting, email
- Metering & measurement field
- Electromechanical control
- Missile control
- Virtual reality VR robots