Parameters |
Package / Case |
516-BBGA Exposed Pad |
Supplier Device Package |
516-TEPBGA (27x27) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2008 |
Series |
MPC83xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8313 |
Speed |
267MHz |
Core Processor |
PowerPC e300c3 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
DUART, HSSI, I2C, PCI, SPI |
Co-Processors/DSP |
Security; SEC 2.2 |
Security Features |
Cryptography |
RoHS Status |
ROHS3 Compliant |
KMPC8313EZQADDB Overview
The embedded microprocessor has been packed in 516-BBGA Exposed Pad for convenient overseas shipping. A high level of reliability is provided by using an advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. K0°C~105°C TAw what the operating temperature is around 0°C~105°C TA. The cpu microprocessor belongs to the MPC83xx series. The CPU is powered by a PowerPC e300c3 core. A CPU with this architecture uses DDR, DDR2 RAM controllers. Microprocessors with DUART, HSSI, I2C, PCI, SPI interfaces are designed to serve users better. 1.8V 2.5V 3.3V is the I/O speed of this CPU. MPC8313 is a good way to search for variants of the microprocessor. A supplier offers a 516-TEPBGA (27x27) package.
KMPC8313EZQADDB Features
PowerPC e300c3 Core
KMPC8313EZQADDB Applications
There are a lot of NXP USA Inc. KMPC8313EZQADDB Microprocessor applications.
- 3D printers
- Volt meter
- Instrument control
- Fax machines
- Gas monitoring systems
- Multi-meter
- Calculators
- Projector
- Smoke alarms
- X-ray