KMPC850DEVR80BU
| Parameters | |
|---|---|
| Package / Case | 256-BBGA |
| Supplier Device Package | 256-PBGA (23x23) |
| Operating Temperature | 0°C~95°C TA |
| Packaging | Tray |
| Published | 2001 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC850 |
| Speed | 80MHz |
| Core Processor | MPC8xx |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| USB | USB 1.x (1) |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | ROHS3 Compliant |
KMPC850DEVR80BU Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. High reliability is achieved by using advanced packaging methods Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Extended operating temperature around 0°C~95°C TA. This is a member of the MPC8xx series. MPC8xx processors are embedded in this CPU. The CPU contains DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. In this CPU, I/O is set to 3.3V. Search MPC850 for variants of the embedded microprocessor. Suppliers offer a package of 256-PBGA (23x23).
KMPC850DEVR80BU Features
MPC8xx Core
KMPC850DEVR80BU Applications
There are a lot of NXP USA Inc. KMPC850DEVR80BU Microprocessor applications.
- Entertainment products
- Set-top boxes
- Smart instruments
- Robotic prosthetic limbs
- Paper shredders
- Smartphones-calling, video calling, texting, email
- Teletext terminals
- Microwave ovens
- Digital cameras
- Blood pressure monitors
