Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC850SRZQ50BU Overview
The microprocessor is conveniently packaged in 256-BBGA, making it easy to ship internationally. High reliability is achieved by using advanced packaging methods Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. K0°C~95°C TAw what the operating temperature is around 0°C~95°C TA. In the MPC8xx series, it is found. This CPU uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. 3.3V is the CPU's I/O address. Search MPC850 for variants of the embedded microprocessor.
KMPC850SRZQ50BU Features
KMPC850SRZQ50BU Applications
There are a lot of NXP USA Inc. KMPC850SRZQ50BU Microprocessor applications.
- Graphic terminals
- Measurement and control field
- Television
- Robots
- Dishwashers
- Ipod
- Digital cameras
- Microwave ovens
- Mice
- Virtual reality VR robots