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KMPC850SRZQ50BU

Microprocessor MPC8xx Series MPC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-KMPC850SRZQ50BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 195
  • Description: Microprocessor MPC8xx Series MPC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

KMPC850SRZQ50BU Overview


The microprocessor is conveniently packaged in 256-BBGA, making it easy to ship internationally. High reliability is achieved by using advanced packaging methods Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. K0°C~95°C TAw what the operating temperature is around 0°C~95°C TA. In the MPC8xx series, it is found. This CPU uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. 3.3V is the CPU's I/O address. Search MPC850 for variants of the embedded microprocessor.

KMPC850SRZQ50BU Features



KMPC850SRZQ50BU Applications


There are a lot of NXP USA Inc. KMPC850SRZQ50BU Microprocessor applications.

  • Graphic terminals
  • Measurement and control field
  • Television
  • Robots
  • Dishwashers
  • Ipod
  • Digital cameras
  • Microwave ovens
  • Mice
  • Virtual reality VR robots

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