Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8555 |
Speed |
833MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
DUART, I2C, PCI, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
Non-RoHS Compliant |
KMPC8555EPXAPF Overview
The embedded microprocessor ships overseas conveniently packed in 783-BBGA, FCBGA. High reliability is achieved by using advanced packaging methods Tray. CPUs have 1 Core 32-Bit cores/bus width. Understand how the operating temperature around 0°C~105°C TA is determined. The MPC85xx series contains it. A PowerPC e500 processor is present in this CPU. It has DDR, SDRAM RAM controllers. This microprocessor features DUART, I2C, PCI, SPI, TDM, UART interfaces to better serve its users. The CPU runs I/O at 2.5V 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC8555. Suppliers are offering 783-FCPBGA (29x29) packages.
KMPC8555EPXAPF Features
PowerPC e500 Core
KMPC8555EPXAPF Applications
There are a lot of NXP USA Inc. KMPC8555EPXAPF Microprocessor applications.
- DCS control intelligent sensor
- Projectors
- Measuring revolving objects
- Automatic staplers
- Teletext terminals
- Toys
- Smartphones-calling, video calling, texting, email
- Equipment control
- Fax machines
- Traditional industrial transformation