Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8555 |
Speed |
667MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
DUART, I2C, PCI, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC8555PXALF Overview
Packed in 783-BBGA, FCBGA, the microprocessor is convenient for shipping overseas. Advanced packaging method Tray is used to provide high reliability. Cores/Bus width of the CPU is 1 Core 32-Bit . The operating temperature around 0°C~105°C TA should be understood. In the MPC85xx series, it is found. PowerPC e500 is the processor core of this CPU. A total of DDR, SDRAM RAM controllers are used by this CPU. With its DUART, I2C, PCI, SPI, TDM, UART interfaces, this microprocessor will be able to serve you better. The CPU runs I/O at 2.5V 3.3V. Using MPC8555 will help you find variants of the cpu microprocessor. There is a 783-FCPBGA (29x29) package offered by suppliers.
KMPC8555PXALF Features
PowerPC e500 Core
KMPC8555PXALF Applications
There are a lot of NXP USA Inc. KMPC8555PXALF Microprocessor applications.
- Process control devices
- Kindle
- Copiers
- Measurement and control field
- Hard drives
- Heart rate monitors
- Microwave ovens
- Aerospace navigation systems
- Food and beverage
- Entertainment products