KMPC8555VTALF
| Parameters | |
|---|---|
| Package / Case | 783-BBGA, FCBGA |
| Supplier Device Package | 783-FCPBGA (29x29) |
| Operating Temperature | 0°C~105°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC85xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC8555 |
| Speed | 667MHz |
| Core Processor | PowerPC e500 |
| Voltage - I/O | 2.5V 3.3V |
| Ethernet | 10/100/1000Mbps (2) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DDR, SDRAM |
| USB | USB 2.0 (1) |
| Additional Interfaces | DUART, I2C, PCI, SPI, TDM, UART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | ROHS3 Compliant |
KMPC8555VTALF Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 783-BBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around 0°C~105°C TA. This is a member of the MPC85xx series. The CPU is cored by a processor with a number of 0 cores. There are DDR, SDRAM RAM controllers used by this CPU. This microprocessor features DUART, I2C, PCI, SPI, TDM, UART interfaces to better serve its users. 2.5V 3.3V is the I/O speed of this CPU. To find variants of the microprocessor, try searching with MPC8555. There is a 783-FCPBGA (29x29) package offered by suppliers.
KMPC8555VTALF Features
PowerPC e500 Core
KMPC8555VTALF Applications
There are a lot of NXP USA Inc. KMPC8555VTALF Microprocessor applications.
- Air fryers
- Security systems
- Automobile
- Entertainment-radios, CD players, televisions
- Laminators
- Missile control
- Industrial robot
- Washing machines
- Equipment control
- Virtual reality VR robots
