Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8555 |
Speed |
1.0GHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
DUART, I2C, PCI, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC8555VTAQF Overview
The embedded microprocessor ships overseas conveniently packed in 783-BBGA, FCBGA. Using advanced packaging techniques Tray, high reliability is ensured. 1 Core 32-Bit cores/Bus width are present in the CPU. Understand the operating temperature around 0°C~105°C TA. In the MPC85xx series, it is found. This CPU is cored with a PowerPC e500 processor. A CPU with this architecture uses DDR, SDRAM RAM controllers. Microprocessors with DUART, I2C, PCI, SPI, TDM, UART interfaces are designed to serve users better. In this CPU, I/O is set to 2.5V 3.3V. Use MPC8555 to search for variants of the cpu microprocessor. Suppliers offer the package 783-FCPBGA (29x29).
KMPC8555VTAQF Features
PowerPC e500 Core
KMPC8555VTAQF Applications
There are a lot of NXP USA Inc. KMPC8555VTAQF Microprocessor applications.
- Magnetic resonance imaging (MRI)
- Scanners
- Torpedo guidance
- Volt meter
- Day to day life field
- Missile control
- DCS control intelligent sensor
- Teletext terminals
- Digital cameras
- Printers