Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC855 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC855TCZQ50D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. It is important to understand the operating temperature around -40°C~95°C TA. MPC8xx is its series number. A total of DRAM RAM controllers are used by this CPU. A HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. I/O is run at 3.3V on this CPU. If you are looking for variants of the cpu microprocessor, try search with MPC855.
KMPC855TCZQ50D4 Features
KMPC855TCZQ50D4 Applications
There are a lot of NXP USA Inc. KMPC855TCZQ50D4 Microprocessor applications.
- Aerospace navigation systems
- Pacemakers (used to control abnormal heart rhythm)
- Hand-held metering systems
- Printers
- Safety field
- Blood pressure monitors
- Fire alarms
- Equipment control
- Security systems
- Teletext terminals