Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC855 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC855TZQ80D4 Overview
Due to its 357-BBGA packaging, it is convenient to ship overseas. Using advanced packaging techniques Tray, high reliability is ensured. Cores/Bus width of the CPU is 1 Core 32-Bit . Identify the operating temperature around 0°C~95°C TA. It comes from the MPC8xx series. A CPU with this architecture uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. There is 3.3V I/O running on this CPU. The microprocessor can be searched for with MPC855 if you are looking for variants.
KMPC855TZQ80D4 Features
KMPC855TZQ80D4 Applications
There are a lot of NXP USA Inc. KMPC855TZQ80D4 Microprocessor applications.
- Hand-held metering systems
- Air fryers
- Petrochemical
- Industrial robot
- Mice
- Robots
- Set-top boxes
- Copiers
- ECG machine
- Glucose monitoring systems (for Type 1 Diabetes)