Parameters |
Package / Case |
784-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8560 |
Speed |
667MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
Additional Interfaces |
I2C, PCI, RapidIO, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC8560PX667LC Overview
With a packing size of 784-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. There are 1 Core 32-Bit cores/bus width on the CPU. K0°C~105°C TAw what the operating temperature is around 0°C~105°C TA. From the MPC85xx series. Core-wise, this CPU has a PowerPC e500 processor. There are DDR, SDRAM RAM controllers on this CPU. This microprocessor is equipped with an interface of I2C, PCI, RapidIO, SPI, TDM, UART. The CPU runs at 2.5V 3.3V when it comes to I/O. To find variants of the microprocessor, try searching with MPC8560. A supplier offers a 783-FCPBGA (29x29) package.
KMPC8560PX667LC Features
PowerPC e500 Core
KMPC8560PX667LC Applications
There are a lot of NXP USA Inc. KMPC8560PX667LC Microprocessor applications.
- Safety field
- Television
- Aerospace navigation systems
- Oscilloscopes
- Sonography (Ultrasound imaging)
- Leakage current tester
- Medical instruments chromatographs
- Digital set-top boxes
- Measuring revolving objects
- Traditional industrial transformation