Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860DECVR50D4 Overview
The embedded microprocessor ships overseas conveniently packed in 357-BBGA. High reliability is achieved by using advanced packaging methods Tray. The CPU has 1 Core 32-Bit cores/Bus width. Understand how the operating temperature around -40°C~95°C TA is determined. From the MPC8xx series. A total of DRAM RAM controllers are used by this CPU. A I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 3.3V. Using MPC860 will help you find variants of the cpu microprocessor.
KMPC860DECVR50D4 Features
KMPC860DECVR50D4 Applications
There are a lot of NXP USA Inc. KMPC860DECVR50D4 Microprocessor applications.
- Binding machines
- Process control devices
- Broadband technology, video and voice processing
- Glucose monitoring systems (for Type 1 Diabetes)
- Fire alarms
- Graphic terminals
- Consumer electronics products
- Walkie talkies
- Gas monitoring systems
- Fax machines