Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860DECZQ50D4 Overview
The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. The packaging method Tray provides high reliability. CPUs have 1 Core 32-Bit cores/bus width. Understand how the operating temperature around -40°C~95°C TA is determined. A MPC8xx series item. There are DRAM RAM controllers on this CPU. A I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. The CPU runs at 3.3V when it comes to I/O. If you are looking for variants of the cpu microprocessor, try search with MPC860.
KMPC860DECZQ50D4 Features
KMPC860DECZQ50D4 Applications
There are a lot of NXP USA Inc. KMPC860DECZQ50D4 Microprocessor applications.
- Paper shredders
- Safety field
- Toasters
- Heater/Fan
- Sonography (Ultrasound imaging)
- Teletext terminals
- Safety -airbags, automatic braking system (ABS)
- Removable disks
- Ipad
- Volt meter