Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860DPVR66D4 Overview
Packed in 357-BBGA, the microprocessor is convenient for shipping overseas. In order to provide high reliability, advanced packaging method Tray is used. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~95°C TA should be understood. From the MPC8xx series. This CPU uses DRAM RAM controllers. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. There is 3.3V I/O running on this CPU. Using MPC860 will help you find variants of the cpu microprocessor.
KMPC860DPVR66D4 Features
KMPC860DPVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860DPVR66D4 Microprocessor applications.
- Auto-breaking system
- Printers
- Electronic jamming systems
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Process control devices
- Oscilloscopes
- Industrial robot
- Blood pressure monitors
- Fire alarms
- X-ray