Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860DTCVR66D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. The operating temperature around -40°C~95°C TA should be understood. From the MPC8xx series. The CPU uses DRAM RAM controllers. With its HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. There is 3.3V I/O running on this CPU. You can search for variants of a microprocessor with MPC860.
KMPC860DTCVR66D4 Features
KMPC860DTCVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860DTCVR66D4 Microprocessor applications.
- Set-top boxes
- Embedded gateways
- Ipod
- Mice
- Hearing aids
- Industrial robot
- Oscilloscopes
- Digital TVs
- DDC control
- Toys