Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860DTZQ80D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores/bus width on the CPU. The operating temperature around 0°C~95°C TA should be understood. MPC8xx is its series number. A CPU with this architecture uses DRAM RAM controllers. A HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. This CPU runs I/O at 3.3V. MPC860 is a good way to search for variants of the microprocessor.
KMPC860DTZQ80D4 Features
KMPC860DTZQ80D4 Applications
There are a lot of NXP USA Inc. KMPC860DTZQ80D4 Microprocessor applications.
- Fabric
- PDAs, game consoles
- Hard drives
- Smartphones-calling, video calling, texting, email
- Smoke alarms
- Heater/Fan
- Toasters
- Smart instruments
- Metering & measurement field
- Teletext terminals