Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860ENCVR66D4 Overview
The embedded microprocessor ships overseas conveniently packed in 357-BBGA. High reliability can be achieved by using the advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Identify the operating temperature around -40°C~95°C TA. From the MPC8xx series. A CPU with this architecture uses DRAM RAM controllers. This microprocessor features I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. This CPU runs I/O at 3.3V. Use MPC860 to search for variants of the cpu microprocessor.
KMPC860ENCVR66D4 Features
KMPC860ENCVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860ENCVR66D4 Microprocessor applications.
- Binding machines
- Hand-held metering systems
- Network application field
- Auto-breaking system
- Smartphone
- Graphic terminals
- Light sensing & controlling devices
- Oscilloscopes
- Teletext terminals
- Dialysis machines (performs function of liver)