Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860ENZQ66D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand the operating temperature around 0°C~95°C TA. The MPC8xx series contains it. A CPU with this architecture uses DRAM RAM controllers. Microprocessors with I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces are designed to serve users better. 3.3V is the CPU's I/O address. Use MPC860 when searching for variants of the embedded microprocessor.
KMPC860ENZQ66D4 Features
KMPC860ENZQ66D4 Applications
There are a lot of NXP USA Inc. KMPC860ENZQ66D4 Microprocessor applications.
- Binding machines
- Process control devices
- Communication-bluetooth, Wi-Fi, radio
- Safety field
- Coffee machines
- Keyboards
- Industrial instrumentation devices
- Industrial control field
- Entertainment-radios, CD players, televisions
- Safety -airbags, automatic braking system (ABS)