KMPC860PCVR50D4
| Parameters | |
|---|---|
| Package / Case | 357-BBGA |
| Operating Temperature | -40°C~95°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC860 |
| Speed | 50MHz |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (4), 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | ROHS3 Compliant |
KMPC860PCVR50D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand how the operating temperature around -40°C~95°C TA is determined. MPC8xx is its series number. A CPU with this architecture uses DRAM RAM controllers. With its HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. The CPU runs I/O at 3.3V. Search MPC860 for variants of the embedded microprocessor.
KMPC860PCVR50D4 Features
KMPC860PCVR50D4 Applications
There are a lot of NXP USA Inc. KMPC860PCVR50D4 Microprocessor applications.
- Air fryers
- Metering & measurement field
- Automatic staplers
- Telephone sets
- Fire detection & safety devices
- Electromechanical control
- X-ray
- Embedded gateways
- Scanners
- Fabric
