Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860PVR66D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved with advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . It is important to understand the operating temperature around 0°C~95°C TA. MPC8xx is its series number. The CPU contains DRAM RAM controllers. A HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. I/O is run at 3.3V on this CPU. You can search for variants of a microprocessor with MPC860.
KMPC860PVR66D4 Features
KMPC860PVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860PVR66D4 Microprocessor applications.
- Computers and laptops-video calling, email, blogging
- Air fryers
- Coffee machines
- Electromechanical control
- Paper shredders
- Calculators
- PDAs, game consoles
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Digital set-top boxes
- Industrial control field