Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860SRCVR66D4 Overview
Since the microprocessor is packed in 357-BBGA, shipping overseas is convenient. High reliability can be achieved by using the advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. The operating temperature around -40°C~95°C TA should be understood. MPC8xx is its series number. The CPU uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. In this CPU, I/O is set to 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC860.
KMPC860SRCVR66D4 Features
KMPC860SRCVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860SRCVR66D4 Microprocessor applications.
- Ipad
- Fire detection & safety devices
- Guidance-GPS
- Heart rate monitors
- Telephone sets
- Metering & measurement field
- Magnetic resonance imaging (MRI)
- Television
- Computer/laptop
- Traditional industrial transformation