Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860SRCZQ50D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. It is important to understand the operating temperature around -40°C~95°C TA. The cpu microprocessor belongs to the MPC8xx series. DRAM RAM controllers are used by this CPU. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces. In this CPU, I/O is set to 3.3V. You can search for variants of a microprocessor with MPC860.
KMPC860SRCZQ50D4 Features
KMPC860SRCZQ50D4 Applications
There are a lot of NXP USA Inc. KMPC860SRCZQ50D4 Microprocessor applications.
- Oscilloscopes
- Network application field
- Day to day life field
- Network communication, mobile communication field
- Christmas lights
- Calculator
- Digital TVs
- Blood pressure monitors
- Smartphone
- Binding machines